Adaptation Curve

10-Layer AI Hardware Supply Chain

Where the constraints are now

Every layer of the AI hardware stack, scored as a binding constraint or not — across three time horizons. Each call is sourced, dated and refreshed quarterly.

4/10

layers binding right now

4 layers are binding today — semi equipment, cooling & thermal, electrical gear, power generation.

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DEMAND

What's pulling on the system

COMPUTE

Chips, memory & the fabric

FABRICATION

Where wafers & packages are made

PHYSICAL PLANT

Cooling & electrical gear

POWER GENERATION

Turbines, gensets & PPAs