Lens · L1 · Power & the Physical Stack
Solving the chip shortage created the power shortage.
Every constraint the industry clears downstream shoves the bottleneck one layer closer to the wall socket. Watch it travel from packaging (2024) to power generation (2026) — and see what's standing in line behind it.
Why this matters to you
Power lead times now gate your buildout more than GPU allocation. A 2027 cluster is a 2024 substation order — plan the megawatts before the silicon.
Constraint migration · 10 layers × 3 horizons · ▲ rose / ▼ eased QoQ · click a layer to drill
The matrix below shows the full constraint grid with then→now movement. Deep-dives: Power generation, Memory (HBM), Compute – chips.
The old standalone Atlas and Bandwidth Ladder pages remain reachable via Supply Chain → Atlas and Bandwidth Ladder.
The backlog blowout
10-Layer AI Hardware Supply Chain
Where the constraints are now
Every layer of the AI hardware stack, scored as a binding constraint or not — across three time horizons. Each call is sourced, dated and refreshed quarterly.
4/10
layers binding right now
4 layers are binding today — semi equipment, cooling & thermal, electrical gear, power generation.
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NOW
MID-TERM
END OF DECADE
QoQ
Sourced · dated · refreshed quarterly · v2 · 2026-06-16